Flexible, low-cost integrated circuits could transform the market for “smart” devices and packaging, but as Catherine Ramsdale explains, building them requires more than just doing cool science.
A new type of highly flexible ‘superchips’ are being developed in a three-way UK partnership involving Cambridge technology front runners Arm and PragmatIC.
A number of fast-moving consumer goods (FMCG) brands are exploring NFC-enabled smart packaging as an innovative way to connect directly with customers.
Mass-market smart packaging is becoming economically viable.
The potential applications of thin, flexible electronic circuits are tantalising, but will researchers find their ambitions lie outside the laws of physics?
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