Media coverage

Label and package printing industry predictions for 2019

Label and package printing industry predictions for 2019

The label and package printing industry tells L&L what will be big in 2019.

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Printed Electronics World Firsts in 2018

Printed Electronics World Firsts in 2018

With the end of the year in sight, it's interesting to look back and review what has been new in the world of printed electronics in the last 12 months.

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Time for change

Time for change

This year heralds a promising outlook for smart packaging using Near Field Communication technology. Gillian Ewers explains why.

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PragmatIC at the IDTechEx Show in Santa Clara: “To trillions of smart objects and beyond”

PragmatIC at the IDTechEx Show in Santa Clara: “To trillions of smart objects and beyond”

Scott White, CEO at PragmatIC (Cambridge, UK), will give a presentation entitled “To trillions of smart objects and beyond” at the IDTechEx Show in Santa Clara, California, on 15 November 2018.

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Overcoming Challenges for Smart Packaging

Overcoming Challenges for Smart Packaging

Cost, manufacturing remain key obstacles that are being solved throughout the flexible electronics supply chain.

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