FlexLogIC™ fab-in-a-box enables high volume flexIC manufacturing with low up-front capex
PragmatIC, a world leader in flexible electronics, has completed a detailed design study validating its FlexLogIC concept for production scale-up of flexible integrated circuits (flexICs), and is now working towards commissioning of the first system.
The FlexLogIC approach transfers PragmatIC’s proven end-to-end flexIC production process into a self-contained, fully automated, modular “fab-in-a-box” for high throughput manufacturing. The FlexLogIC system offers capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab.
For the FlexLogIC design study, PragmatIC selected VDL Enabling Technologies Group (VDL ETG) based on their enviable track record in on-time, first-time-right delivery of similar complexity manufacturing equipment, as well as their strong expertise in hardware and software automation.
PragmatIC and the VDL ETG Projects business unit are now progressing the next phase of development, with commissioning of the first FlexLogIC system expected in 2017.
Arie van Kraaij, Managing Director of VDL ETG Projects, says: “We have been impressed by PragmatIC’s vision for commercial scale-up of their flexIC technology, and are excited to be involved in its realisation.”
PragmatIC’s Chief Executive Officer, Scott White, adds: “The FlexLogIC system makes the business case for flexICs even more compelling. It enables rapid and cost-effective scaling of capacity for both PragmatIC and our partners, to meet the expanding requirements of our customers.”
Mr White will present the FlexLogIC concept, along with recent commercial progress, at the upcoming LOPEC conference in Munich on 5th April 2016.